Features a tray loading and unloading mechanism, enabling direct tray handling while delivering the efficiency expected of a turret machine, capable of performing standard six-side inspection.

​The upgraded semiconductor testing and sorting machine has made a quantum leap in performance. Compared with the traditional standard version, its UPH can reach 15,000 pcs/h, representing a 50% increase in efficiency. This dramatic improvement in efficiency provides strong support for the sustainable development of the semiconductor industry.

​The dual shuttle loading mechanism reduces the number of occupied workstations and further enhances loading speed, enabling uninterrupted feeding. This significantly minimizes the impact of turret changes on equipment efficiency.

​The tray plate uses an advanced transmission method combining high-precision lead screws and linear guides, ensuring high stability during operation and effectively preventing damage to semiconductor chips caused by mechanical vibration or shaking.

2 defective product sorting bins, supporting multiple feeding methods, with high XY-axis movement precision. Equipped with dust-free drag chains to prevent dust generation.

​In addition to the anti-static fan, which eliminates static electricity from the tray and products, it can effectively ensure the stability of the chips during sorting and transmission.

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