Shenzhen shenkeda Semiconductor Technology Co., Ltd.

Group Stock Code:688328

Service hotline:

+86 0752-5880-900(8280)
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Location:  Home  -> Products  ->  Translation series
2023
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03
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10

SKD308H Pick&Place Test Handler is applicable for testing and sorting MSOP、QFN、DFN、LQFP、LGA、BGA、CSP and other products with specifications ranging from 2x2 to 110x110, meeting the requirements for both room temperature and high-temperature testing and sorting, while delivering high-quality product output for customers.

● Taking and discharging mechanical arm: Y-axis is double-sided drive mode; Z-axis motor independent control, equipped with 2X4 taking and discharging nozzle, X Pitch variable. The nozzle module adopts the span beam design, the center of gravity is stable, not easy to deform.

● Pressure measuring module: equipped with precision floating head and socket stack sensor, automatic calculation of pressure measurement, up to support 120 kgf.

● Shuttle module: XY two directions are equipped with sensors, accurately detect whether the shuttle car is stacked or not flat, protect materials; The unloading shuttle car has the function of return temperature heating.

● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; 200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).

● Plate module: feed plate is equipped with motor screw, it is more convenient to adjust when using different thickness plate.

● Front and rear configuration display touch screen and key panel, support to connect a variety of brand testing machines.


   Contact Information​:+86 13537507730

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2024
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09
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13

SKD308TB TRI-temperature pick&place test handler is applicable for multi-functional testing and sorting needs to meet customers' diverse testing needs. It is suitable for low/normal/high-temperature testing, sorting, and classification of MSOP/QFN/LGA/BGA/CSP(2X2-10X10 mm), and integrates imaging systems to yield high-quality product output to customers.

● Loading and offloading methods: bowl in, supporting two offloading modes: bin out and tray out.

● Image detection: equipped with top image, 3D5S image, used to identify the chip direction and detect appearance defects.

● Loading and unloading nozzle: 2X4 mode, the nozzle can be edged in the X direction, the Z-axis motor of the nozzle is independently controlled, and the Y-axis direction is a bilateral drive mode.

● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; 200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).

● Plate changing manipulator: clamping method, safe and reliable, and also has automatic pull-up function when power fails.

● Testing institution: supports four test modes: single site, two sites(1x2), four sites(1x4, 2x2), and eight sites(2x4).with automatic calibration, automatic calculation of pressure measurement, and socket stacking detection functions .

● Automatic cleaning function: equipped with a cleaning disk assembly, the device automatically cleans the probe after the number of tests reaches the set value.

● Can be connected to multiple brands of testing equipments, has independent software property rights, and supports RS232/TTL/GPIB and other communication methods.


   Contact Information​:+86 13537507730

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2025
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11
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13

The SKD308T tri-temperature pick and place test handler is suitable for DFN, QFN, LQFP, LGA, BGA, CSP, SOP, MSOP and other product specifications in 2X2-110X110 low temperature/normal temperature/high temperature test and classification requirements. To bring high quality product output to customers.

● Taking and discharging mechanical arm: Y-axis is double-sided drive mode; Z-axis motor independent control, equipped with 2X4 taking and discharging nozzle, X Pitch variable. The nozzle module adopts the span beam design, the center of gravity is stable, not easy to deform.

● Pressure measuring module: equipped with precision floating head and socket stack sensor, automatic calculation of pressure measurement, up to support 120 kgf.

● Shuttle module: XY two directions are equipped with sensors, accurately detect whether the shuttle car is stacked or not flat, protect materials; The unloading shuttle car has the function of return temperature heating.

● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; 200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).

● Plate module: feed plate is equipped with motor screw, it is more convenient to adjust when using different thickness plate./span>

● Automatic cleaning function: configure the cleaning plate assembly, the device automatically cleans the probe after the number of tests reaches the set value.

● Changing tray pickup arms: clamping claw mode, stable and reliable, with power failure automatic pull-up function.

● Front and rear configuration display touch screen and key panel, support to connect a variety of brand testing machines.


   Contact Information​:+86 13537507730

Scan to add WeChat​

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