● Loading and offloading methods: bowl in, supporting two offloading modes: bin out and tray out.

● Image detection: equipped with top image, 3D5S image, used to identify the chip direction and detect appearance defects.

● Loading and unloading nozzle: 2X4 mode, the nozzle can be edged in the X direction, the Z-axis motor of the nozzle is independently controlled, and the Y-axis direction is a bilateral drive mode.

● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; 200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).

● Plate changing manipulator: clamping method, safe and reliable, and also has automatic pull-up function when power fails.

● Testing institution: supports four test modes: single site, two sites(1x2), four sites(1x4, 2x2), and eight sites(2x4).with automatic calibration, automatic calculation of pressure measurement, and socket stacking detection functions .

● Automatic cleaning function: equipped with a cleaning disk assembly, the device automatically cleans the probe after the number of tests reaches the set value.

● Can be connected to multiple brands of testing equipments, has independent software property rights, and supports RS232/TTL/GPIB and other communication methods.

   Contact Information​：+86 13537507730​

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