SKD308T tri-temperature pick and place test handler
The SKD308T tri-temperature pick and place test handler is suitable for DFN, QFN, LQFP, LGA, BGA, CSP, SOP, MSOP and other product specifications in 2X2-110X110 low temperature/normal temperature/high temperature test and classification requirements. To bring high quality product output to customers.
● Pressure measuring module: equipped with precision floating head and socket stack sensor, automatic calculation of pressure measurement, up to support 120 kgf.
● Shuttle module: XY two directions are equipped with sensors, accurately detect whether the shuttle car is stacked or not flat, protect materials; The unloading shuttle car has the function of return temperature heating.
● Temperature control system: Test TJ: ±2℃; Preheating tray/Shuttle: ±3℃; TC: ±1℃; 200W@ -55℃/300W@ -40℃/850W @ 25℃/1150W@ 85~150℃ / 200℃(Optional).
● Plate module: feed plate is equipped with motor screw, it is more convenient to adjust when using different thickness plate.
● Automatic cleaning function: configure the cleaning plate assembly, the device automatically cleans the probe after the number of tests reaches the set value.
● Changing tray pickup arms: clamping claw mode, stable and reliable, with power failure automatic pull-up function.
● Front and rear configuration display touch screen and key panel, support to connect a variety of brand testing machines
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Bilateral drive structure: bilateral double slider synchronous belt drive structure, high precision, fast speed, long life. | Z-axis motor independent control, 2X4 mode, suction nozzle XPitch variable. Adopts the cross-beam mode design, the center of gravity is stable, the structure is stable and not easy to deform. | The shuttle is equipped with XY two direction sensors, and the shuttle car has the function of return temperature heating. |
Parameter Information


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