What is IC testing? IC testing is to use relevant electronic instruments (such as multimeters, oscilloscopes, DC power supplies, ATE, etc.) to test the circuit functions and electrical performance parameters of the IC. The test items generally include: DC parameters (voltage, current), AC parameters (THD, frequency), functional tests, etc.

The sorting equipment is used in the FT test link after chip packaging. It is a back-end test equipment that provides chip screening and classification functions. The sorter is responsible for transporting the input chips to the test module according to the pick-and-place method designed by the system to complete the circuit pressure test. In this step, the sorter selects and classifies the circuits according to the test results.

Nowadays, the ultra-large-scale integrated circuit factories in the world (called wafer factories in Taiwan, for the sake of simplicity, this article will also use this name) are mainly distributed in a few developed countries and regions such as the United States, Japan, Western Europe, Singapore, and Taiwan. The Taiwan region occupies a pivotal position.

Turret type testing and sorting machine is used for testing, marking, sorting and taping of extremely small semiconductor devices. The inverted DDR servo motor, the vertical shaft, the aluminum alloy rotating table mounted on the shaft, the frame and other components, the feeding mechanism, the unloading and braiding mechanism, and the computer that controls the actions of other components.

The manufacturing process of semiconductor components can be divided into two major projects: wafer processing in the first stage and packaging and testing in the second stage. In the whole process of post packaging test production, the test sorter occupies a pivotal position. Next, I will share with you the technical indicators involved in the selection of semiconductor testing sorter, hoping to give you something