Shenzhen shenkeda Semiconductor Technology Co., Ltd.

Group Stock Code:688328

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We often listen to semiconductors. It sounds like they are technologically advanced. But actually, semiconductor means literally. The conductive is called conductor, the non-conductive is called insulator, and the conductive property between conductor and insulator is called semiconductor. This is a kind of material. Common compounds such as silicon, germanium and silver sulfide are semiconductors. In fact, it has already penetrated into all aspects of our lives, ranging from mobile phones, laptops, digital cameras and other consumer electronics to aerospace, mechanical equipment manufacturing and other fields

When a semiconductor product is manufactured, it generally goes through eight steps: wafer processing – oxidation – lithography – etching – film deposition – interconnection – testing – packaging. Among them, semiconductor testing is an indispensable link in the semiconductor industry chain, which directly affects the yield and quality of terminal products

The three core equipment involved in semiconductor testing are the testing machine and the sorter as the probe table. They are mainly used to detect chip performance and defects in the semiconductor manufacturing process. Throughout the semiconductor production process, they can be divided into wafer testing (CP) and finished product testing (FT). The specific testing process is as follows:

1. Wafer detection

Generally, wafer testing occurs after the wafer processing and before the packaging process. The main equipment used are the probe table and testing machine

The probe table first automatically transfers the wafer piece by piece to the test location, and the pad point of the chip is connected to the functional module of the tester through the probe and special connection line. Then the tester applies input signals to the chip and collects output signals. Through electrical parameter detection, it judges the effectiveness of each grain on the wafer, marks abnormal grains, and reduces subsequent costs

2. Finished product testing

Finished product test refers to the functional and electrical parameter performance test of the chip through the cooperation of the sorter and the tester after the chip is packaged to ensure that the functional and performance indicators of each chip delivered can meet the design specification requirements

The test process is as follows: the sorter automatically transmits the detected chips to the test station one by one, and then the pins of the detected chips are connected with the functional modules of the tester through the base and special connecting lines on the test station. Finally, the chip tester applies input signals to the chips and collects output signals to judge whether the functions and performance of the chips meet the design specification requirements

It should be noted that with the development of semiconductor integrated circuit industry model becoming more and more refined, semiconductor testing tasks will become more complex and diversified, so sorting equipment will inevitably be required to have higher speed and accuracy, more functional modules and more expandable and more general testing capabilities

Since its establishment, Shenzhen Keda Semiconductor has been focusing on the research, development, production, sales and technical services of semiconductor component test sorters, and is able to provide optimal cost-effective comprehensive solutions for performance verification and quality inspection of various types of devices and chips. If customers are willing to build their own test systems, Shenzhen Keda Semiconductor can help users provide high-quality test hardware through its own advantages and channel resources, and provide technical support according to different levels of needs